HDI PCB Via-in-pad Filled Vias Thin Laminate And Prepreg

FOB Price: Get Latest Price
|
- (Min. Order)
  • Supplying Ability-
  • Supplying TypeOem service
  • Model Number2
  • Preferred Payment Method:-

HX Circuit Technology Co.,Ltd.

China

Port: -

Contact Supplier

Quick Details

  • Processing Time:-
  • Port:-
  • Supply Ability: -
  • Brand Name:-
Application Field: Communication Layer/Board Thickness: 8L/1.5mm Surface Treatment: ENIG Line/Space: 4.0/4.0mil Smallest Hole Diameter: 0.15mm Technical Feature: 1+1+4+1+1，Micro vias，plugged resin and plated over

Other Products
From This Supplier

Related Categories

Premium Products

Eltek 241115.

You May Be Intrested In

Worldwide Importers