General Description: The 932 series provides protection for printed circuit boards used in a large variety of
applications that need fuses with time-delay, low breaking capacity. The sub-miniature device is constructed of a plastic cap and base with a tin plated copper lead wire. It offers excellent
mounting characteristics and is 100% tested for cold resistance.
Main Characteristics: Square sub-miniature fuse; Time-Lag (T)
Standard :IEC 60127-3/IV
Materials：
Fuse body: Thermoplastic ; Lead: Tin plated coppe
Operating Temperature：
-55℃ to +125℃
Storage Conditions ：+10℃ to +60℃
Relative humidity:≤75% yearly average
without dew, maximum 30 days at 95%
Vibration Resistance：
24 cycles at 15 min. each (60068-6)
10-60Hz at 0.75mm amplitude
60-2000Hz at 10g acceleration
Soldering Parameters ：260℃.≤5 sec (Wave Soldering) ; 350℃.≤3 sec (Hand Soldering)
Soldering Peak: 260℃. 10 sec. (IEC 60068-20)
