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0.95 W/mK Chomerics T725 replacing high performance ZIITEK thermal conductive PCM phase change
materials T725P For IGBTs
T725P series is low melting point thermal interface material. At 50℃, T725P series begins to soften and flow, filling the microscopic irregularities of both the
thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.T725P series is a flexible solid at room temperature and freestanding without reinforcing
components that reduce thermal performance.
T725P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal
migration (pump out)at operating temperatures.
Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Features:
For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required
Typical Properties of T725P Series
Product Name
TICTM805P
Testing standards
Color
Pink
Visual
Composite Thickness
0.005"
(0.126mm)
Thickness Tolerance
±0.0008"
(±0.019mm)
Density
2.2g/cc
Helium Pycnometer
Work Temperature
-25℃～125℃
phase transition temperature
50℃~60℃
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.024℃-in²/W
ASTM D5470 (modified)
0.15℃-cm²/W
Standard Thicknesses:
0.005"(0.127mm)
Standard Sizes:
10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
