Quick Details
- Processing Time:30-60days
- Port:Shanghai Port
- Supply Ability: -
- Cutting Thickness:<2mm
- Cutting Speed:?600mm/s
- Cutting Area:2, 4, or 6 inches
- Cooling Mode:air cooling
- Condition:New
- CNC or Not:NOT
- Certification:ISO9001
- Brand Name:Delphi
- Application:Wafer Grooving(AlGaInP)
- Applicable Material:Silicon, gallium arsenide
- After-sales Service Provided:Yes
- Laser Type:DPSS 355nm ultraviolet laser
- Model Number:AS-5360
- Place of Origin:China
- Brand Name:Delphi
Laser System for Wafer Grooving(AlGaInP)
Feature
Fast scribing speeds; high yield rates; high production capacity
◆ Produces high-quality results with no residue or
melt-back
◆ Fully-automatic processing; integrated coating
application, wafer cutting, and cleaning functions
Technical Specification
Laser type:
DPSS 355nm ultraviolet laser
◆ Laser
power: ≥5W
◆ Cooling
method: Closed-loop water cooling
◆ X-axis
cutting speed: ≤600mm/s
◆ Applicable
wafer sizes: 2, 4, or 6 inches
◆ Cutting line
width: <15μm@
40μm grooving depth
◆ Dicing street width: ≥30μm
◆ Processing
method: Automatic single-axis processing via front-side or backside cutting
◆ Imaging system: Coaxial CCD and paraxial CCD
◆ Scribing
depth: Can vary or maintain a constant scribing
◆ Lighting
system: High-power LED light with adjustable brightness
Applicable workpieces:
◆ Applicable materials: Silicon, gallium arsenide
◆ Process
workflow: Protective coating application à Laser cutting à Wafer cleaning
▋Sample Figure：
