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PRODUCT DESCRIPTION
Magnetron Sputtering is widely used to deposit refractory metals like tantalum, titanium, tungsten, niobium, which would require very high temperatures of deposition,
and precious metals: Gold and Silver and which is also used for deposition of lower melting points metals like copper, aluminum, nickle, chrome etc.
Tantalum is most used in the electronic industry as a protective coating because of its good resistance to erosion.
Applications of Sputtered Tantalum thin film:
1. Microelectronics industry as the films can be reactively sputtered and thus resistivity and temperature coefficient of resistance can be controlled;
Medical instruments like body implants for its highly biocompatability property;
Coatings on corrosion resistant parts, such as thermowells, valve bodies, and fasteners;
Sputtered tantalum can be also be used as an effective corrosion resistance barrier if the coating is continuous, defected and is adherent to the substrate is intended to
protect.
Technical Advantages
A standardized trolley is applied which allows easy and safe loading/unloading of the substrate holders and work pieces in/out of the deposition chamber
The system is safety interlocked to prevent incorrect operation or unsafe practices
The substrate heaters are provided which mounted in the center of chamber, PID controlled thermocouple for high accuracy, to enhance the condense film’s adhesion
Strong vacuum pumps configurations with Magnetically suspension molecular pump via gate valve connected to chamber; backed with Leybold’s roots pump and two stage rotary vane pump,
mechanical pump.
High energy ionized plasma source is applied with this system to guarantee the uniformity and density.
Royal Technology’s standardized Tantalum sputtering deposition system:
Main Configurations
MODEL
RTAS1000
TECHNOLOGY
Pulsed DC magnetron sputtering
Cathodic arc plating (for option, determined by coating process)
CHAMBER MATERIAL
Stainless Steel (S304)
CHAMBER SIZE
Φ1000*1000mm (H)
CHAMBER TYPE
D shape, cylindrical chamber
ROTATION RACK & JIG SYSTEM
Satellite driving or central driving system
POWER SUPPLIES
DC Sputtering Power Supply: 2~4 sets
Bias Power supply: 1 set
Ion Source: 1 set
DEPOSITION MATERIAL
Ta, Ti/Cr/TiAl, Au, Ag, Cu etc.
DEPOSITION SOURCE
Planar Sputtering Cathodes + circular arc cathodes
CONTROL
PLC(Programmable Logic Controller) + IPC
( manual+ auto+ semi-auto operation models)
PUMP SYSTEM
Rotary Vane Pump: SV300B – 1 set (Leybold)
Roots Pump: WAU1001 – 1 set (Leybold)
Holding Pump: D60C – 1 set (Leybold)
Magnetic Suspension Molecular Pump:
MAG2200 – 2 sest (Leybold)
GAS MASS FLOW CONTROLLER
2 channels: Ar and N2
VACUUM GAUGE
Inficon or Leybold
SAFETY SYSTEM
Numerous safety interlocks to protect operators and equipmen
HEATING
Heaters: 20KW. Max. temp.: 450℃
COOLING
Industrial Chiller (Cold Water)
POWER MAX.
100KW (Approx.)
AVERAGE POWER CONSUMPTION
45 KW (Approx.)
GROSS WEIGHT
T (Approx.)
FOOT PRINT
( L*W*H) 4000*4000 *3600 MM
ELECTRICAL POWER
AC 380V/3 phases/50HZ / 5 line
