Smart Automatic Bga Rework Station DH-A6

Ⅰ. Function/Features: 1. There are authority for supervisor and operator whose names can be changed/written/stored in, and the serial number of the repaired PCB and the used heat profile can be stored as many as required. 2. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset; 3. Automatic disassembly, automatic welding, automatic recycle of chips, completely liberating workers; 4. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is more efficient, and the rework of the large chip is better; 5. Laser positioning, place the motherboard in one step; 6. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant temperature, environmental protection and energy saving, and prevent small components/dust from dropping; 7. External temperature measurement interfaces, convenient for temperature detection at any time, temperature control is more accurate and reliable; 8. Touch screen operation, preset program, which can be used proficiently without professional technical training, making chip repair very easy; 9. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple; 10. An external USB interface is used for software updates and various repair data to be imported into the computer for analysis and storage; 11. The large preheating temperature zone can satisfy the rework of the large motherboard of 550*650mm. 11.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....) Ⅱ. Product parameter Power Supply: AC220V±10％ 50/60Hz Rated Power:  6800W Top heater:  1200W Bottom heater:  1200W IR preheating area:  4200W (Germany heating tube, heating area of 500*350mm) Operation mod:  Fully automatically disassemble,suction,mounting and soldering Basic configuration:                                        Automatic feeding delivery system+HD digital                                      camera+Japanese Misumi suction rod system+Panasonic CCD                                      optical counterpoint system+HD digital display PC+Panasonic                                      servo+Panasonic PLC+an 8-inch digital touchscreen +Grinding                                      level guide rail(Taiwan Hiwin)+Dalian Institute of Technology                                       10-channel temperature control system+ American Omega                                        Temperature measurement system+High fever efficiency and                                         heating tube+ Resistance to 1800 degree black crystal sand glass Chip feeding system:  Automatic receiving, feeding, automatic induction (optional) Temperature profile storage:  50000 groups Optical CCD lens:                                    Automatic stretch out and go back, which can be moved freely                                   before and after by rocker, to eliminate the "observation dead                                   corner" problem Chip angel adjust:  Φ Angle can be 360° rotation, precision fine tuning fitting                                       suction nozzle PCBA Positioning:  Up and down intelligent positioning,bottom "5-point support"                                        with V-groove fixed PCB which can be adjusted freely in the                                       X-axis direction, with universal fixtures meanwhile BGA position:  Laser positioning to quickly find the vertical point of the upper                             and lower temperature zone and the central point of BGA Temperature control:  K-type Sensor,Closed loop and 8~20 segments for temperature                                             controlling program Temperature accuracy:  ±1 ℃ Placement Accuracy +/-0.01mm CCD system:  A CCD HD digital camera, 6 million pixels(Industrial-class),                             automatic optical zoom, laser positioning Pressure sensor:  Inductive pressure greater than 0.010-0.030g/c m² will initiate                                   collision pressure protection Safety guard:  pressure sensor +emergency knob,double-guard. Workbench fine-tuning:  Back/front±15mm,left/right±15mm PCB size:  Max490*550 mm Min 10×10 mm PCB thickness:  0.2-15mm BGA chip:  1x1-65*65mm Gas source:  External gas source BGA suction mode:  Negative pressure vacuum suction, automatic induction release                                           in place BGA weight:  5-500g (special specification customization) Minimum chip spacing:  0.15mm External Temperature Sensor:  5 pcs（optional) Machine type:  Desktop table (optional) Dimensions:  L970*W850*H950 mm Net weight:  120kg