Quick Details
- Color:Black
- Viscosity:15000cps～20000cps
- Cure Condition:30Min@80℃
- Glass Transition Temperature:65℃
- Hardness:≥70D
- Shear Strength:15Mpa
- Storage Condition:6months@-20℃
- Packaging:30ml/50ml
- Processing Time:-
- Port:Qingdao
- Supply Ability: -
- Brand Name:Low Temperature Curing Adhesive
This product is a single-component, low-temperature, fast-heat-curing modified epoxy resin adhesive—excellent adhesion between many different materials at lower temperatures and in a short
time. The product has excellent working performance and high storage stability.
Application: Bonding for camera module, LED backlight and low temperature process component.
