Quick Details
- Color:Black
- Viscosity:500cps~1000cps
- Cure Condition:15~20Min@80℃/ 10Min@120℃
- Glass Transition Temperature:70℃
- Repairability:Good
- Storage Condition:6months@-5℃
- Packaging:30ml/50ml
- Processing Time:-
- Port:Qingdao
- Supply Ability: -
- Brand Name:DOCBOND
The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, effectively reducing the impact caused by the
mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower
viscosity characteristics allow for better underfilling; and good reworkability
Application：
Mobile phones, smart terminals, onboard vehicles, Other handheld devices, etc. Filling of CSP/BGA
