Quick Details
- Color:White Paste
- Viscosity:300000cps~800000cps
- Cure Condition:3~5Min@25℃
- Thermal Conductivity:0.76W/(m·k
- Volume Resistivity:1.3 x 10 13Ω·cm
- Shear Strength:≥12Mpa
- Storage Condition:12months@25℃
- Packaging:300ml
- Processing Time:-
- Port:Qingdao
- Supply Ability: -
- Brand Name:DOCBOND
It is a thermally conductive adhesive for bonding electronic components to heat sinks or printed circuit boards. The combination of fast room temperature cure for thermally sensitive parts with
excellent heat dissipation and controllable strength for easy repair servicing is the perfect replacement for tapes, epoxies, silicones, fasteners, and mechanical fixtures. Appling to thermal
bonding of chips and heat sinks.
Advantage：High thermal conductivity，1.2 W/(m. K）; Fast positioning. It only takes 1-2 minutes to solidify and position; stable performance.
