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PRODUCT DESCRIPTION
Chip Molding Machine
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
Customization:
TJIN Semiconductor Molding Machine - Customized Service
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Product Attributes:
Auto Transfer Molding
Auto Packaging Equipment
Auto Packaging Equipment
Injection Unit: Single
Max. Mold Height: 400 Mm
Screw Diameter: 35 Mm
Cooling System: Water
Control System: PLC
Packing and Shipping:
Product Name: Semiconductor Molding Machine
Packaging and Shipping:
Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
The packaging also includes foam inserts to protect the delicate components of the machine.
For international shipping, the machine will be packed in a wooden crate for extra protection.
The package will be labeled with the product name, model number, and any necessary handling instructions.
For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.
Technical Parameters:
Technical Parameters
Value
Screw Diameter
35 mm
Model
SM-1000
Clamping Force
1000 KN
Platen Size
600 x 600 mm
Cooling System
Water
Max. Mold Height
400 mm
Capacity
100 tons
Type
Vertical Injection Molding Machine
Injection Pressure
200 MPa
Heating Power
12 KW
Product Features
Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness
0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
FAQ:
Q: What is the brand name of this product?
A: The brand name is TJIN.
Q: What is the model number of this product?
A: The model number is 001.
Q: Where is this product manufactured?
A: This product is manufactured in China.
Q: Does this product have any certifications?
A: Yes, it is certified with ISO9001.
Q: What is the minimum order quantity for this product?
A: The minimum order quantity is 1.
Q: How is this product packaged?
A: It is packaged in wooden packaging.
Q: What is the estimated delivery time for this product?
A: The estimated delivery time is 40 days.
Q: What are the accepted payment terms for this product?
A: The accepted payment terms are TT (telegraphic transfer).
