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very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit.
Surface: Mill,mirror,brush,hair line,checkered .etc
Main Purpose: Copper strip can be made to do all sorts of deep drawing and bending stress components, such as manufacturing pins,rivets, gasket, nuts, conduits, the barometer
spring, screen, radiator parts, etc
The product surface is black or red, has lower surface roughness,high density, high bending resistance and good etching performance, used for Flexible Copper Clad Laminate(FCCL),Fine Circuit
FPC,LED coated crystal thin film.
Products usage:
- Flexible Printed Circuit.
- LED layer of HDI .
ED copper foil Specifications.
1) Thickness Range: 0.035mm.
2) standard width:1290mm.
3) ID: 76 mm,152 mm.
4) Cu Content: 99.8%.
VLP ED Copper Foil Characteristics.
1. Zinc-free.
2. Excellent physics of high elongation Performance.
Difference between rolled copper foil and electrolytic copper foil.
Process is difference: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process).
Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.
Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.
Classification
Unit
Requirement
Test Method
Foil Designation
/
1
H
M
1
IPC-4562A
Nominal thickness
/
10um
12um
1/2 OZ (18um)
3/4 OZ(25um)
1 OZ(35um)
IPC-4562A
Area Weight
g/㎡
98±4
107±4
153±5
228±8
285±10
IPC-TM-650
2.2.12.2
Purity
％
≥99.8
IPC-TM-650
2.3.15
Foil Profile
Shiny side(Ra)
սm
≤2.5
≤2.5
≤2.5
≤2.5
≤2.5
IPC-TM-650
2.3.17
Matte side(Rz)
um
≤2.5
≤2.5
≤2.5
≤2.5
≤2.5
Tensile Strength
R.T.(23℃)
Mpa
≥300
≥300
≥300
≥300
≥300
IPC-TM-650
2.3.18
H.T.(180℃)
Mpa
≥200
≥200
≥200
≥200
≥200
Elongation
R.T.(23℃)
％
≥4
≥5
≥6
≥8
≥10
IPC-TM-650
2.3.18
H.T.(180℃)
％
≥5
≥6
≥7
≥8
≥8
Peel Strength(FR-4)
N/mm
≥0.8
IPC-TM-650
2.4.8
Ibs/in
≥4.6
Pinholes&porosity
Number
No
IPC-TM-650
2.1.2
Anti-oxidization
R.T.(23℃)
180days
/
H.T.(200℃)
60 Minutes
/
