Expanded Polystyrene EPS Insulation Board

Expanded polystyrene EPS insulation board Features: 1, Excellent thermal insulation performance Polystyrene insulation board mainly take polystyrene as raw materials, polystyrene itself is an excellent low thermal conductivity materials, and extruded and molded to form a tight honeycomb structure, which can effectively prevent the heat conduction. Thermal conductivity of Polystyrene board is 0.028 / m k, has high thermal resistance, low linear expansion rate characteristics. Thermal conductivity is much lower than other insulation materials. At the same time, the board is light, inexpensive and has a stable chemical structure and physical structure, which can ensure lasting and stable insulation performance of the material, and it is one of excellent thermal insulation materials. 2, high-strength compressive properties Polystyrene board  have high compressive strength, it can remains unchanged for a long time even if it is soaked the in water , have great bearing capacity and good impact resistance. 3, superior water resistance, moisture resistance Polystyrene board has a tight closed-cell structure, polystyrene molecular structure itself is not hydrophilic, there is no gap both in the front and back of the plate   so water absorption is very low, and moisture and impermeability is excellent. 4, weather resistance Polystyrene board has excellent anti-corrosion, anti-aging, and the thermal insulation life is up to 30-40 years. 5, light weight, construction convenience The completely closed-cell foam structure of Polystyrene board cab form a lightweight and uniform honeycomb structure ,so it has high hardness, and not easily damaged, easy to handle, easy to install, easy to cut, and it will not affect the bearing capacity of the structure when used as a roof insulation.   EPS polystyrene board performance index Item Unit Index Ⅰ Ⅱ Ⅲ Density Kg/m3 ≥15.0 ≥20.0 ≥30.0 Compressive strength Kpa ≥60 ≥100 ≥150 Size change rate after 70℃ 48h % ≤5 ≤5 ≤5 Thermal conductivity w/m.k ≤0.040 ≤0.040 ≤0.039 Bonding Breaking bending angle load N ≥15 ≥25 ≥35 Bending deformation mm ≥20 ≥20 ≥20 Water absorption % ≤6 ≤4 ≤2 Moisture absorption coefficient Ng/pa.m.s ≤9.5 ≤4.5 ≤4.5 Oxygen index % ≥30 ≥30 ≥30