PCB Manufacturing Services Buyer and Importer

Need PCB with following specs:Layer No.:1-12 Layers PCB Test:Flying probe and AOI (Default)/Fixture Test Base, Cover film, Stiffeners thickness::0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um BGA Ball Pitch:1mm ~ 3mm(4mil ~ 12mil) PCB Assembly Method:SMT, Through-hole, Mixed, BGA PCB Assembly Test:Visual Inspection (default), AOI, FCT, X-RAY Hi-TG FR4 Material:Tg-130 Tg-140 Tg-160 Tg-170 Electrical Testing:Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test Certificate Standard:IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need Special requirements:Buried and blind vias, Impedance control, via plug, BGA soldering etc.mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um BGA Ball Pitch:1mm ~ 3mm(4mil ~ 12mil) PCB Assembly Method:SMT, Through-hole, Mixed, BGA PCB Assembly Test:Visual Inspection (default), AOI, FCT, X-RAY Hi-TG FR4 Material:Tg-130 Tg-140 Tg-160 Tg-170 Electrical Testing:Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test Certificate Standard:IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need Special requirements:Buried and blind vias, Impedance control, via plug, BGA soldering etc. Show More