Packaging Aluminum Foil Bag Thermal Insulation Bubble Mailer Buyer and Importer

Material:Aluminum Foil Bubble ESD Shielding Bags Style:open top/zip lock/gusset/cubic Usage:PC board,computer main board,IC integrated circuit ,CD driver Thickness:0.075mm(3mil) Printing logo:could be printed according to customers' requirements Sizes:Customized Surface Resistance:10(8-11) Ohm Color:semi-transparent Material Structure:APET/CPP Or APET/CPE Show More

  • Posted On:20 Apr, 2024
  • Company Name:Show
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United States

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