Introduction
Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common thermal pad and solution.
This series of products are resilient and good amount of deformation, Suitable for large institutional design tolerances, Product is Low Density ,The Double layer use of special ultra-thin fabric reinforcement, Heavy resistance and increased workability, whether punching punch, strip type, Malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel. Self-adhesive never recede. No corrosion on the Copper surface. Completely non-toxic and green products accord to international requirements
As demands for faster electronic devices increase, typically so does the amount of heat generated. If heat can not escape efficiently, the performance of the device tends to suffer. That is why GLPOLY’s thermal interface materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.
Features
Designed for automotive
Low density
Ultra conformable
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
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