ITEM | TECHNICAL DATA |
Layers | 1-28(layers) |
Max Board Size | 457 x 610mm |
  Min Board Thickness | 4(layers)0.60mm/24mil |
6(layers)0.80mm/32mil | |
8(layers)1.00mm/40mil | |
10(layers)1.20mm/48mil | |
Min h | 0.10mm  /4mil |
Min e | 0.10mm  /4mil |
Min Hole Size | 0.20mm  /8mil |
PTH Wall Thickness | 0.020mm /0.8mil |
PTH dia tolerance | ±0.05mm /±2mil |
NPTH hole dia tolerance | ±0.025mm /±1mil |
Hole Position Deviation | ±0.05mm /±2mil |
Qutrance | ±0.1mm  /±4mil |
S/M Pitch | 0.08mm   /3mil |
Insulation Resistance | 1E + 12Ω (Normal) |
Aspect ratio | 10:1 |
Thermal shock | 288℃(10 seconds 3 times)/3x10Sec@288℃ |
Warp and Twist | ≤0.7% |
Electric Strength | >1.3KV/mm |
Peel Strength | 1.4N/MM |
Solder Mask Abrasion | ≥6H |
Flammability | 94V-0 |
Impedance Control | ±5% |
Product Range:
4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board, halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board, 1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products.
Product Applications:
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