Rohs 94v0 Electronic 2 layers PCB Printed Circuit Board Prototype Assembly Manufacturer Origin: China Location: Gedian Development Zone, Ezhou City,Hubei Province,China Supply Type: oem service Processing Time: 3-7 days Min Order: 10
Supplier Info. Location Gedian Development Zone, Ezhou City,Hubei Province,China Employees Total Annual Revenue
PCB Capability CapabilityStandard AdvancedLaminate materialsFR4 / FR1 / CEM-3 / CEM-1 / Aluminum /Teflon / High-TG / Rogers / TaconicSurface FinishHASL (vertical & Horizontal), Lead Free HASL,HASL+Gold Finger,OSP/Entek,ENIG, ENEPIG,Immersion Tin(ISn) ,Immersion Silver(IAg),Carbon Ink, Hard Gold(Flash Gold), Soft GoldMin. Thickness for inner layers0.020"-0.125"0.003â(0.07mm)Board layers1-12 Layers1-24 LayersBoard Thickness0.5mm-3mm0.2mm-7mmCopper weight0.5 oz â 3 oz0.5 oz â 6 ozMinimum Trace Width / Spacing0.004"/0.004"0.003"/0.003"Solder Mask ColorGreen,Blue,Black,Red,Yellow,White, and customized Drill deviation0.008"±0.002â (0.05mm)PTH hole tolerance0.008"±0.002â (0.005mm)NPTH hole tolerance0.008"±0.002â (0.005mm)Min hole size0.010"0.008â (0.02mm)E-testFlying Probe Tester/Test-Jig/X-ray/ICT/AOI/FCTControlled Tolerance±15%±10%Silkscreen ColorWhite, Black, Yellow, Green, Red, Blue and customized Min solder mask clearance size0.0080.003â (0.07mm)Thickness0.020"-0.125"0.0005-0.0007â(0.012-0.017mm)Min silkscreen clearance size0.010"0.006â (0.15mm)IPC ClassClass 2Class 3Blind ViasYESYESBuried ViasYESYESAspect Ratio8/115/1Peelable MaskYESYESCarbon InkYESYESSolder SampleYESYESFirst ArticleYESYESCertificate:UL / SGS / ROH / ISO/TS16949 / ISO14001:2004Acceptable file formatGERBER file, PROTEL 99/PADS / POWER PCB / AutoCAD /EGLE PCB Assembly Capability ItemCapabilityAdvantages----Professional Surface-mounting and Through-hole soldering technology----Various sizes like 1206,0805,0603 components SMT technology----ICT(In Circuit Test),FCT(Functional Circuit Test) ----PCB Assembly With UL,CE,FCC,Rohs Approval----Nitrogen gas reflow soldering technology for SMT.----High Standard SMT&Solder Assembly Line---High density interconnected board placement technology capacity.ComponentsPassive Down to 0201 sizeBGA and VFBGALeadless Chip Carriers/CSPDouble-sided SMT AssemblyFine Pitch to 0.8milsBGA Repair and ReballPart Removal and ReplacementQuantityPrototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000and customizedType of AssemblySMT, Thru-holeSolder TypeWater Soluble Solder Paste, Leaded and Lead-FreeBare Board SizeSmallest:0.25*0.25 inchesLargest:20*20 inchesFile FormateGerber files, Pick-N-Place file, Bill of MaterialsTypes of ServiceTurn-key,partial turn-key or consignmentComponent packagingCut Tape,Tube,Reels,Loose PartsTurn TimeSame day service to 15 days serviceTestingFlying Probe Test,X-ray Inspection AOI TestPCB assembly processDrilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing