â—†The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc.
 ◆◆The H.F. Preheating process is widely applied for Thermo-set plastic molding such as for electric components, mechanical parts, bakelite products, urea formaldehyde plastics products, melamine tablewares, and packaging of IC, commutator, transistors and other micro-electronic components.
The device can be used to improve the surface glossiness of products, prevent water-like wrinkle and strengthen the fluidness of powder resin. It can pre-heat and soften the powder resin (caking) prior to the plastic packaging for the electronic components and semi-conductor IC, so as to improve the grade  and performance for the products.
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