Technologies
âAspect ratio up to 25 âBig size board assemblyâBoard flatness <0.3% âBoard thickness 9.1 mm âEmbedded component PCBâHigh speed and low loss materialsâLayer count up to 40âMinimum h / spacing 2 milâVIP (via in pad) : conductive-conductive copper paste ; non-conductive-epoxy via hole fillApplications Burn-in, load board and probe Card