Technologies
âAny layer HDIâAspect ratio up to 25âBack drillâBoard thickness 10 mm / 390 milâCavity down âHigh speed and low loss materialsâLayer count up to 40 âMicro via copper-fill plate âMinimum h / spacing 2 milâThermal management-coin insertedâVIP (via in pad) : conductive-conductive copper paste ; non-conductive-epoxy via hole fillApplications Optical Fiber Conversion Module, Ethernet Module, Small form Factor Pluggable (SFP) System and Thunderbolt