TechnologiesâAny layer HDI âAspect ratio up to 25âBack drillâBoard thickness 10 mm / 390 milâCavity downâDiversity specialty processes PCB & PCBAâHeavy-copper products up to 6 oz(210 µm)âHigh speed, low loss and multiple material combination / RF microwave high performance materialâIPC-A-600 class 3 certified productsâLayer count up to 40âMetal core PCB (aluminum & copper)/coin thermal managementâMicro via Cu fill plateâMinimum line width / spacing 2 milâRigid-flex PCBâTightened impedance control toleranceâVIP (via in pad) : conductive-copper paste / conductive paste ; non-condective-epoxy via hole fillApplications Satellite Antenna, Fiber Optic Broadband, Broadband Central Office, LNB (Low Noise Block Down Converter), VSAT (Very Small Aperture Terminal), Microwave Radio System, RFID Reader System, Communication Base Station Equipment and 4G LTE Device
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