Technologiesâ—Any layer HDIâ—Aspect ratio up to 25â—Board thickness range from 10 mil to 390 mil(0.25 to 9.0 mm) â—Flex-rigid boardâ—Heavy-copper products up to 6 oz (210 µm)â—High speed, low loss and high performance materials â—Layer count up to 40â—Minimum h / spacing 2 milâ—Thermal management-coin insertedâ—Tightened impedance control toleranceâ—VIP (via in pad) : conductive- conductive copper paste ; non-conductive-epoxy via hole fillApplications Power Management System, Storage System, Tablet PC, Embedded Computer System, Positioner, NC Rotary Table, Hydraulic Parts Leveler, Grinding Machine, Stainless Steel Cleaning Machine and Embossing Machine
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