TechnologiesâAny layer HDI âAspect ratio up to 25 âBack drillâBoard thickness 10 mm / 390 milâCavity down âHigh speed and low loss materialsâLayer count up to 40âMicro via copper-fill plateâMinimum line width / spacing 2 mil (50 micro meters)âThermal management-coin insertedâVIP (via in pad) : conductive-conductive copper paste ; non-conductive-epoxy via hole fillApplications Smart Phones, Internet of Things, Multimedia A/V, Telecommunication Equipment, Sensing Component, Smart TV, DVD/Blu-ray Storage System, Smart Audio System, Home Networking Device System, Smart CPU&GPU, Broadband Gateway and Set-top Box, Tablet, LTE Modem Platform, RF Transceiver, NFC( Near Field Communication) Product, Bluetooth Product, GPS (Global Positioning System) Product, Wireless Charging and Wearable Device.
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