TechnologiesâAny layer HDIâAspect ratio up to 25âBack drillâBoard thickness range from 10 to 390 mil (0.25 to 9 mm) âHigh speed and low loss materials âLayer count up to 40âMicro via Cu fill plateâMinimum line width / spacing 2 milâVIP (via in pad) : conductive-conductive copper paste; non-conductive-epoxy via hole fillApplications Server, Notebook Computer, Cloud Server, Telecommunication Equipment, Computer Camera Accessories, WIFI Base Station, Set-top Box Microconsole, Smartwatch, Disk Storage System, Network Switch, IOT(Internet of Things), Storage Area Network, Gaming Controller, Docking Station, Remote Control, Projector, Monitor and Integrated Touch Panel
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