Silicon Wafer Grinder Equipment Buyer and Importer from India - Buying Lead

Silicon Wafer Grinder Equipment

specifications regarding Silicon Surface Grinding Machine. Input workpiece dimension: 1) Material : Silicon 2) Workpiece size (diameter) : up to 150 mm 3) Initial Thickness : up to 500 microns Output workpiece requirements: 1) Output Thickness : 30 to 80 microns (acc Show More...

specifications regarding Silicon Surface Grinding Machine. Input workpiece dimension: 1) Material : Silicon 2) Workpiece size (diameter) : up to 150 mm 3) Initial Thickness : up to 500 microns Output workpiece requirements: 1) Output Thickness : 30 to 80 microns (acc. to user requirement) 2) Flatness : less than 0.2 microns 3) Surface roughness (Rz) : less than 0.2 microns(with grinding) 4) Thickness variation : + - 1.5 microns

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• Purchaser: Ravi kumar

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