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Packaging Aluminum Foil Bag Thermal Insulation Bubble Mailer Buyer and Importer from United States - Buying Lead

21 Nov, 2020

Packaging Aluminum Foil Bag Thermal Insulation Bubble Mailer

Material:Aluminum Foil Bubble ESD Shielding Bags Style:open top zip lock gusset cubic Usage:PC board,computer main board,IC integrated circuit ,CD driver Thickness:0.075mm(3mil) Printing logo:could be printed according to customers' requirements Sizes:Customized Surface Resistance:10(8-11) Ohm Color:semi-transparent Material Structure:APET CPP Or APET CPE

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