Goldlink Tongda Electronics Co., Ltd

Goldlink Tongda Electronics Co., Ltd

Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority. Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.

Products

Our business includes Silicone Thermal Pad, Silicone Rubber Pad, Silicone Putty Pad, Silicone Thermal Tape, Thermal Interface Grease, Two-part Thermal Interface Sealing Compound, Silicone Thermal Gel, Thermal Interface Phase Change Materials and Non-Silicone type products.  

Applications

We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.

• Business Type: Manufacturer
• Main Products: Thermal Gap Pad, Thermal Gap Filler, Eletric Vehicle Battery Cooling Pad, Thermal Putty and Silicone free Thermal Materials
• Main Markets: America, Europe, WorldWide
• Established year: 2008
• Total Annual Revenue: US$5 Million - US$10 Million
• Export Percentage: 31% - 40%
• Address: Block 45, Baoan Shenzhen China
• Phone Number : Membership Required
• Country: China
• Key Products: Thermal Gap Pad, Thermal Gap Filler, Eletric Vehicle Battery Cooling Pad, Thermal Putty and Silicone free Thermal Materials
• Other Products: thermally conductive insulator, thermal sealing compound, thermal tape